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Core Competence

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Strong design capabilities: The R&D team has more than ten years of development experience, optical design simulation, high-speed circuit design, radio frequency simulation, structural design and thermal simulation, large-scale multi-series optic transceiversautomated test system development.

Proprietary packaging technology: Automatic high-precision placement, automatic die bonding, ultra-high-precision laser welding, automatic packaging and testing, continuous innovation and exploration. The optical transceivers product development platform develop from 10G, 25G, and 100Gb and continues to improve.

Product supply chain: Through cooperation and coordination of the entire supply chain, a pull demand and supply is generated.Reduce product costs under the condition of ensuring product quality. Provide customers high-quality products and competitive price.

MES Manufacturing Execution System: It is connected with the company's self-developed test automation system, which could realize real-time, accurate and comprehensive data collection. Accurate performance and quality analysis SPC, comprehensive and complete product tracking & tracing function


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